Mitsubishi Electric Begins Supplying Power Semiconductor Chips Made from 12-inch Wafers for Semiconductor Module Assembly

Stable supply of Si power semiconductor chips expected to support green transformation

Mitsubishi Electric Corporation (TOKYO: 6503) announced today that its Power Device Works’ Fukuyama Factory has begun large-scale supply of power semiconductor chips made from 12-inch silicon (Si) wafers for the assembly of semiconductor modules, effective immediately. The advanced Si power-semiconductor modules will initially be used in consumer products. Going forward, Mitsubishi Electric expects to contribute to green transformation (GX) by providing a stable and timely supply of semiconductor chips to meet the growing demand for energy-saving power-electronics devices in various applications.

The Fukuyama Factory processes wafers for the production of Si power-semiconductors. The factory is playing a key role in Mitsubishi Electric’s medium-term plan to double its wafer processing capacity for Si power- semiconductors by fiscal 2026 compared to five years earlier. By supplying large quantities of 12-inch Si wafers for power semiconductor chips, the company will ensure stable production of advanced Si power-semiconductor modules for energy-saving power-electronics equipment.

For the full text, please visit: www.MitsubishiElectric.com/news/

Contacts

More News

View More

Recent Quotes

View More
Symbol Price Change (%)
AMZN  210.11
+5.25 (2.56%)
AAPL  264.58
+4.00 (1.54%)
AMD  200.15
-3.22 (-1.58%)
BAC  53.06
+0.29 (0.55%)
GOOG  314.90
+11.34 (3.74%)
META  655.66
+10.88 (1.69%)
MSFT  397.23
-1.23 (-0.31%)
NVDA  189.82
+1.92 (1.02%)
ORCL  148.08
-8.46 (-5.40%)
TSLA  411.82
+0.11 (0.03%)
Stock Quote API & Stock News API supplied by www.cloudquote.io
Quotes delayed at least 20 minutes.
By accessing this page, you agree to the Privacy Policy and Terms Of Service.