Form 6-K

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

 


FORM 6-K

 


REPORT OF FOREIGN PRIVATE ISSUER

Pursuant to Rule 13a-16 or 15d-16

under the Securities Exchange Act of 1934

For the month of July 2006

Commission File Number 1-31994

 


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION

(Translation of Registrant’s Name Into English)

 


18 Zhangjiang Road

Pudong New Area, Shanghai 201203

People’s Republic of China

(Address of Principal Executive Offices)

 


(Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F):

Form 20-F      X            Form 40-F              

(Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101(b)(1)):

Yes                      No      X    

(Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101(b)(7)):

Yes                      No      X    

(Indicate by check mark whether by furnishing the information contained in this Form, the registrant is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934):

Yes                      No      X    

(If “Yes” is marked, indicate below the file number assigned to the registrant in connection with Rule 12g3-2(b): 82-            )

Semiconductor Manufacturing International Corporation (the “Registrant”) is furnishing under the cover of Form 6-K:

 

Exhibit  99.1: Press announcement, dated July 28, 2006, containing the Registrant’s results of operations for the three months ended June 30, 2006.

 



SIGNATURE

Pursuant to the requirements of the Securities Exchange Act of 1934, the Registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

 

Semiconductor Manufacturing International Corporation
By:  

/s/ Richard R. Chang

Name:   Richard R. Chang
Title:   President and Chief Executive Officer

Date: July 28, 2006


EXHIBIT INDEX

 

Exhibit  

Description

Exhibit 99.1:   Press announcement, dated July 28, 2006, containing the Registrant’s results of operations for the three months ended June 30, 2006.


Exhibit 99.1

The Stock Exchange of Hong Kong Limited takes no responsibility for the contents of this announcement, makes no representation as to its accuracy or completeness and expressly disclaims any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this announcement.

LOGO

SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION

LOGO

(Incorporated in the Cayman Islands with limited liability)

(STOCK CODE: 0981)

SMIC REPORTS RESULTS FOR THE THREE MONTHS ENDED JUNE 30, 2006

 

  Semiconductor Manufacturing International Corporation (NYSE: SMI; SEHK: 981) (“SMIC” or the “Company”), one of the leading semiconductor foundries in the world, today announced its consolidated results of operations for the three months ended June 30, 2006. Sales increased 2.9% in the second quarter of 2006 to $361.4 million from $351.1 million in the prior quarter. The Company reported an increase in capacity to 167,251 8-inch equivalent wafers per month and a utilization rate of 93.5% in the second quarter of 2006. Gross margins were 13.6% in the second quarter of 2006 compared to 12.4% in the first quarter of 2006. Net income was $2.2 million in the second quarter of 2006, compared to a net loss of $8.7 million in the first quarter of 2006. The Company recognized an income tax benefit of $18.9 million in the second quarter as a result of strategic tax planning based on US GAAP FAS 109 (Accounting for Income Taxes).

 

  Set out below is a copy of the full text of the press release made in the United States by the Company on July 28, 2006 in relation to its results for the three months ended June 30, 2006.

 

  This announcement is made pursuant to the disclosure obligations under Rule 13.09(1) of The Rules Governing the Listing of Securities on The Stock Exchange of Hong Kong Limited as the Company made the press release, reproduced below, on July 28, 2006.

Set out below is a copy of the full text of the press release made in the United States by the Company on July 28, 2006 in relation to its results for the three months ended June 30, 2006.

All currency figures stated in this report are in US Dollars unless stated otherwise.

The financial statement amounts in this report are determined in accordance with US GAAP.

Overview:

 

  Sales increased to $361.4 million in 2Q06, up 2.9% from 1Q06 and up 29.3% from 2Q05.
  Gross margins of 13.6% in 2Q06, up from 12.4% in 1Q06.
  Net income of $2.2 million in 2Q06, compared to a net loss of $8.7 million from 1Q06 and a net loss of $40.4 million in 2Q05.

Shanghai, China – July 28, 2006. Semiconductor Manufacturing International Corporation (NYSE: SMI; SEHK: 981) (“SMIC” or the “Company”), one of the leading semiconductor foundries in the world, today announced its consolidated results of operations for the three months ended June 30, 2006. Sales increased 2.9% in the second quarter of 2006 to $361.4 million from $351.1 million in the prior quarter. The Company reported an increase in capacity to 167,251 8-inch equivalent wafers per month

 

1


and a utilization rate of 93.5% in the second quarter of 2006. Gross margins were 13.6% in the second quarter of 2006 compared to 12.4% in the first quarter of 2006. Net income was $2.2 million in the second quarter of 2006, compared to a net loss of $8.7 million in the first quarter of 2006. The Company recognized an income tax benefit of $18.9 million in the second quarter as a result of strategic tax planning based on US GAAP FAS 109 (Accounting for Income Taxes).

“We continue to improve on our manufacturing core competency as we saw an increase in our revenues from 0.13 micron and below technologies contributing 47.5% of total revenues in the second quarter,” said Dr. Richard Chang, Chief Executive Officer of SMIC. “Revenues generated from 0.13 micron logic products as a percentage of our logic revenues significantly increased to 22.5% from 13.3% in the first quarter. We expect this trend to continue as more of our customers migrate to our 0.13 micron and 90 nanometer logic processes.

In the second quarter, we successfully qualified and commenced commercial production of our first 90nm logic product at our 300mm facility in Beijing. Also, we have successfully qualified Elpida’s 512M-bit DDR2 SDRAM using a 90nm manufacturing process also at our 300mm facility in Beijing.

We have delivered the first engineering samples and are pleased to announce that Saifun’s 90nm NROM Flash is functional. This marks an important achievement towards commencing production of this product in the fourth quarter of 2006.

We are cautiously optimistic on our outlook for the second half of 2006 as some customers have pushed out wafer orders due to an ongoing inventory correction. However, the postponement of these orders is offset by the growing strength in the China market as we see the emergence of Mainland China customers and overseas customers partnering with SMIC to help gain market share in China. We are pleased with the development of our Mainland China customers and expect that the percentage of revenues from these customers will continue to increase. In addition, we are observing a promising trend of global semiconductor companies choosing to work with SMIC to take advantage of our proximity to their China end-market customer.

As we continue to execute on our business plans, we are carefully laying down a solid foundation for future growth and development in the foundry industry and will expand our business in a financially disciplined manner.”

Conference Call/Webcast Announcement

Date: July 28, 2006

Time: 8:00 a.m. Shanghai time

Dial-in numbers and pass code: U.S. 1-617-597-5342 or HK 852-3002-1672 (Pass code: SMIC).

A live webcast of the 2006 second quarter announcement will be available at http://www.smics.com under the “Investor Relations” section. An archived version of the webcast, along with a soft copy of this news release will be available on the SMIC website for a period of 12 months following the webcast.

About SMIC

SMIC (NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated circuit (IC) manufacturing service at 0.35µm to 90nm and finer line technologies. Headquartered in Shanghai, China, SMIC operates three 200mm fabs in Shanghai and one in Tianjin, and one 300mm fab in Beijing, the first of its kind in Mainland China. SMIC has customer service and marketing offices in the U.S., Italy, and Japan as well as a representative office in Hong Kong. For additional information, please visit http://www.smics.com.

 

2


Safe Harbor Statements

(Under the Private Securities Litigation Reform Act of 1995)

This press release may contain, in addition to historical information, “forward-looking statements” within the meaning of the “safe harbor” provisions of the U.S. Private Securities Litigation Reform Act of 1995. These forward-looking statements, including statements concerning SMIC’s expectations that revenues from 0.13 micron and below technologies as a percentage of total revenues and percentage of revenues from Mainland China customers would continue to increase, statements concerning the trend of global semiconductor companies choosing to work with SMIC, statements concerning the manner in which SMIC will execute its business plan and expand its business, and statements under “Capex Summary” and “Third Quarter 2006 Guidance” below, are based on SMIC’s current assumptions, expectations and projections about future events. SMIC uses words like “believe,” “anticipate,” “intend,” “estimate,” “expect,” “project” and similar expressions to identify forward-looking statements, although not all forward-looking statements contain these words.

These forward-looking statements are necessarily estimates reflecting the best judgment of SMIC’s senior management and involve significant risks, both known and unknown, uncertainties and other factors that may cause SMIC’s actual performance, financial condition or results of operations to be materially different from those suggested by the forward-looking statements including, among others, risks associated with cyclicality and market conditions in the semiconductor industry, intense competition, timely wafer acceptance by SMIC’s customers, timely introduction of new technologies, SMIC’s ability to ramp new products into volume, supply and demand for semiconductor foundry services, industry overcapacity, shortages in equipment, components and raw materials, availability of manufacturing capacity and financial stability in end markets.

Investors should consider the information contained in SMIC’s filings with the U.S. Securities and Exchange Commission (SEC), including its annual report on Form 20-F, as amended, filed with the SEC on June 29, 2006, especially in the “Risk Factors” and “Management’s Discussion and Analysis of Financial Condition and Results of Operations” sections, and its registration statement on Form A-1 as filed with the Stock Exchange of Hong Kong (SEHK) on March 8, 2004, and such other documents that SMIC may file with the SEC or SEHK from time to time, including on Form 6-K. Other unknown or unpredictable factors also could have material adverse effects on SMIC’s future results, performance or achievements. In light of these risks, uncertainties, assumptions and factors, the forward-looking events discussed in this press release may not occur. You are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date stated, or if no date is stated, as of the date of this press release.

Except as required by law, SMIC undertakes no obligation and does not intend to update any forward-looking statement, whether as a result of new information, future events or otherwise.

 

Investor Contacts:  
Calvin Lau           Douglas Hsiung
+86-21-5080-2000 ext. 16693           +86-21-5080-2000 ext. 12804
calvin_lau@smics.com           douglas_hsiung@smics.com
Mobile: +852-9435-2603           Mobile: +86-13795272240
Mobile: +86-13636468590  

 

3


Summary of Second Quarter 2006 Operating Results

Amounts in US$ thousands, except for EPS and operating data

 

     2Q06     1Q06     QoQ     2Q05     YoY  

Sales

     361,446       351,138     2.9 %     279,500     29.3 %

Cost of sales

     312,229       307,768     1.4 %     273,111     14.3 %

Gross profit

     49,217       43,370     13.5 %     6,389     670.4 %

Operating expenses

     56,141       49,335     13.8 %     38,469     45.9 %

Loss from operations

     (6,924 )     (5,965 )   16.1 %     (32,081 )   – 78.4 %

Other income (expenses)

     (9,491 )     (7,807 )   21.6 %     (8,234 )   15.3 %

Income tax credit (expense)

     18,892       (14 )   —         118     —    

Net income (loss) after income taxes

     2,476       (13,786 )   —         (40,433 )   —    

Minority interest

     767       947     -19.0 %     (12 )   —    

Share of loss of an affiliate company

     (1,002 )     (1,058 )   -5.3 %     —       —    

Cumulative effect of a change in accounting principle

     —         5,154     —         —       —    

Income (loss) attributable to holders of ordinary shares

     2,242       (8,743 )   —         (40,445 )   —    

Gross margin

     13.6 %     12.4 %       2.3 %  

Operating margin

     -1.9 %     -1.7 %       -11.5 %  

Net income (loss) per ordinary share – basic(1)

   $ 0.0001     $ (0.0005 )     $ (0.0022 )  

Net income (loss) per ADS – basic

   $ 0.0061     $ (0.0239 )     $ (0.1113 )  

Net income (loss) per ordinary share – diluted(1)

   $ 0.0001     $ (0.0005 )     $ (0.0022 )  

Net income (loss) per ADS – diluted

   $ 0.0060     $ (0.0239 )     $ (0.1113 )  

Wafers shipped (in 8” wafers)(2)

     388,498       388,010     0.1 %     330,499     17.5 %

Logic ASP(3)

   $ 979     $ 945     3.6 %   $ 938     4.4 %

Blended ASP

   $ 888     $ 862     3.0 %   $ 807     10.0 %

Simplified ASP(4)

   $ 930     $ 905     2.8 %   $ 846     9.9 %

Capacity utilization

     93.5 %     94.9 %       86.5 %  

Note:

 

(1) Based on weighted average ordinary shares of 18,303 million (basic) and 18,729 million (diluted) in 2Q06, 18,278 million (basic/diluted) in 1Q06 and 18,169 million (basic/diluted) in 2Q05
(2) Including copper interconnects
(3) Excluding copper interconnects
(4) Total sales/total wafers shipped

 

  Sales increased to $361.4 million in 2Q06, up 2.9% QoQ from $351.1 million in 1Q06 and up 29.3% YoY from $279.5 million in 2Q05 primarily due to a 3% increase in the blended ASP.

 

  Cost of sales increased to $312.2 million in 2Q06, up 1.4% QoQ from $307.8 million in 1Q06, primarily due to a product mix shift.

 

  Gross profit increased to $49.2 million in 2Q06, up 13.5% QoQ from $43.4 million in 1Q06 and up 670.4% YoY from $6.4 million in 2Q05.

 

  Gross margins increased to 13.6% in 2Q06 from 12.4% in 1Q06, primarily due to an improved product mix.

 

  Operating expenses of $56.1 million in 2Q06, up 13.8% QoQ from $49.3 million in 1Q06.

 

4


  Loss from operations of $6.9 million in 2Q06, up 16.1% QoQ from a loss of $6.0 million in 1Q06.

 

  Other non-operating loss of $9.5 million in 2Q06, up 21.6% QoQ from a loss of $7.8 million in 1Q06, primarily due to a foreign exchange loss of $2.0 million in 2Q06.

 

  Net foreign exchange loss of $6.8 million in 2Q06.

 

  Net income of $2.2 million in the second quarter of 2006, compared to a net loss of $8.7 million in the first quarter of 2006 and a net loss of $40.4 million in the second quarter of 2005.

 

  As a result of a tax planning strategy that became effective in 2Q06, a temporary difference between the tax and book basis of certain assets was created. Under FAS 109, the Company recognized an income tax benefit of $18.9 million.

 

 

Analysis of Revenues           
Sales Analysis           
By Application    2Q06     1Q06     4Q05     3Q05     2Q05  
          

Computer

   30.6 %   36.0 %   34.8 %   33.7 %   39.8 %

Communications

   46.2 %   45.8 %   43.8 %   39.8 %   40.4 %

Consumer

   18.6 %   13.3 %   16.6 %   22.8 %   15.2 %

Others

   4.6 %   4.9 %   4.8 %   3.7 %   4.6 %
By Device    2Q06     1Q06     4Q05     3Q05     2Q05  

Logic (including copper interconnect)

   66.6 %   62.8 %   65.3 %   65.5 %   58.9 %

DRAM(1)

   28.8 %   32.4 %   31.3 %   31.0 %   36.5 %

Other (mask making & probing, etc.)

   4.6 %   4.8 %   3.4 %   3.5 %   4.6 %
By Customer Type    2Q06     1Q06     4Q05     3Q05     2Q05  

Fabless semiconductor companies

   49.8 %   41.8 %   43.2 %   43.2 %   42.2 %

Integrated device manufacturers (IDM)

   41.9 %   52.8 %   51.7 %   52.8 %   55.2 %

System companies and others

   8.3 %   5.4 %   5.1 %   4.0 %   2.6 %
By Geography    2Q06     1Q06     4Q05     3Q05     2Q05  

North America

   46.7 %   43.5 %   39.2 %   42.9 %   40.8 %

Asia Pacific (ex. Japan)

   20.9 %   21.3 %   28.2 %   25.7 %   26.3 %

Japan

   4.9 %   3.3 %   3.6 %   4.5 %   6.0 %

Europe

   27.5 %   31.9 %   29.0 %   26.9 %   26.9 %
Wafer Revenue Analysis           
By Technology (logic, DRAM &copper interconnect only)    2Q06     1Q06     4Q05     3Q05     2Q05  

0.13µm and below

   47.5 %   46.6 %   42.9 %   43.8 %   44.5 %

0.15µm

   4.7 %   8.7 %   5.2 %   2.7 %   2.5 %

0.18µm

   38.0 %   35.7 %   42.3 %   45.3 %   40.7 %

0.25µm

   2.0 %   1.6 %   3.3 %   3.1 %   3.9 %

0.35µm

   7.8 %   7.4 %   6.3 %   5.1 %   8.4 %
By Logic Only(1)    2Q06     1Q06     4Q05     3Q05     2Q05  

0.13µm and below(2)

   22.5 %   13.3 %   10.9 %   14.7 %   12.6 %

0.15µm

   7.2 %   14.5 %   8.6 %   5.3 %   4.8 %

0.18µm

   55.8 %   57.7 %   65.3 %   67.4 %   59.4 %

0.25µm

   2.5 %   2.3 %   4.8 %   4.0 %   7.1 %

0.35µm

   12.0 %   12.2 %   10.4 %   8.6 %   16.1 %

 

5



Note:

 

(1) Excluding 0.13µm copper interconnects

 

(2) Represents revenues generated from manufacturing full flow wafers

 

  Sales from the consumer products segment grew faster than other applications in 2Q06 compared to 1Q06.

 

  Percentage of sales from logic wafers, including copper interconnects, increased to 66.6% of sales in 2Q06, as compared to 62.8% in 1Q06 and 58.9% in 2Q05.

 

  Percentage of sales generated from North America and Japan customers in 2Q06 increased to 46.7% and 4.9%, respectively as compared to 43.5% and 3.3% in 1Q06, respectively.

 

  Percentage of wafer revenues from 0.13µm and below technologies increased to 47.5% of sales in 2Q06, as compared with 46.6% in 1Q06 and 44.5% in 2Q05.

 

  Percentage of logic only wafer revenues from 0.13µm and below technologies increased to 22.5% of sales in 2Q06, as compared with 13.3% in 1Q06 and 12.6% in 2Q05.

Capacity

 

Fab/(Wafer Size)    2Q06(1)    1Q06(1)

Fab 1 (8”)

   43,000    43,000

Fab 2 (8”)

   49,034    47,954

Fab 4 (12”)

   35,438    30,220

Fab 7 (8”)

   17,216    15,000
         

Total monthly wafer fabrication capacity

   144,688    136,174

Copper Interconnects:

     

Fab 3 (8”)

   22,563    21,156
         

Total monthly copper interconnect capacity

   22,563    21,156

Note:

 

(1) Wafers per month at the end of the period in 8” wafers

 

  As of the end of 2Q06, monthly capacity increased to 167,251 8-inch equivalent wafers mainly due to the expansion at the Beijing (Fab 4) and Tianjin (Fab 7) sites.

Shipment and Utilization

 

8” equivalent wafers    2Q06     1Q06     4Q05     3Q05     2Q05  

Wafer shipments including copper interconnects

   388,498     388,010     376,227     355,664     330,499  

Utilization rate(1)

   93.5 %   94.9 %   93.0 %   92.1 %   86.5 %

Note:

 

(1) Capacity utilization based on total wafer out divided by estimated capacity

 

  Wafer shipments increased to 388,498 units of 8-inch equivalent wafers in 2Q06 up 0.1% QoQ from 388,010 units of 8-inch equivalent wafers in 1Q06, and up 17.5% YoY from 330,499 8-inch equivalent wafers in 2Q05.

 

6


  Utilization rate decreased to 93.5%.

 

Blended and Simplified Average

    Selling Price (ASP) Trend

  

Logic Average Selling Price (ASP) Trend

(excluding 0.13µm copper interconnects)

LOGO    LOGO
The blended and simplified ASP increased to $888 and $930 in 2Q06 from $862 and $ 905 in 1Q06 respectively, mainly due to an improved product mix shift to the 0.13µm and below technology nodes.    The logic ASP (excluding 0.13µm copper interconnects) increased to $979 in 2Q06 from $ 945 in 1Q06, mainly due to an improved product mix shift to the 0.13µm and below technology nodes.

Detailed Financial Analysis

Gross Profit Analysis

Amounts in US$ thousands

 

     2Q06     1Q06     QoQ     2Q05     YoY  

Cost of sales

   312,229     307,768     1.4 %   273,111     14.3 %

Depreciation

   188,663     189,054     – 0.2 %   171,216     10.2 %

Other manufacturing costs

   123,566     118,714     4.1 %   101,895     21.3 %

Gross Profit

   49,217     43,370     13.5 %   6,389     670.4 %

Gross Margin

   13.6 %   12.4 %     2.3 %  

 

  Cost of sales increased to $312.2 million in 2Q06, up 1.4% QoQ from $307.8 million in 1Q06, primarily due to a product mix shift.

 

  Gross profit increased to $49.2 million in 2Q06, up 13.5% QoQ from $43.4 million in 1Q06 and up 670.4% YoY from $6.4 million in 2Q05.

 

  Gross margins increased to 13.6% in 2Q06 from 12.4% in 1Q06, primarily due to a higher blended ASP from a product mix shift.

Operating Expense Analysis

Amounts in US$ thousands

 

     2Q06    1Q06    QoQ     2Q05    YoY  

Total operating expenses

   56,141    49,335    13.8 %   38,469    45.9 %

Research and development

   24,345    20,593    18.2 %   17,590    38.4 %

General and administrative

   16,837    11,749    43.3 %   7,207    133.6 %

Selling and marketing

   3,918    5,970    -34.4 %   3,590    9.2 %

Amortization of intangible assets

   11,041    11,023    0.2 %   10,082    9.5 %

 

7


  Total operating expenses were $56.1 million in 2Q06, an increase of 13.8% QoQ from $49.3 million in 1Q06.

 

  Research and development expenses increased to $24.3 million in 2Q06, up 18.2% QoQ from $20.6 million in 1Q06, primarily due to increased depreciation and amortization costs associated with R&D and a decrease in R&D subsidy from the previous quarter.

 

  General and administrative expenses increased to $16.8 million in 2Q06, up 43.3% QoQ from $11.7 million in 1Q06, primarily due to foreign exchange losses of $4.8 million in 2Q06.

 

  Selling and marketing expenses decreased to $3.9 million in 2Q06, down 34.4% QoQ from $6.0 million in 1Q06, primarily due to decreased engineering material expense.

 

  Amortization of acquired intangible assets representing amortization expenses associated with the acquisition of intangible assets was $11.0 million in 2Q06.

Other Income (Expenses)

Amounts in US$ thousands

 

     2Q06     1Q06     QoQ     2Q05     YoY  

Other income (expenses)

   (9,491 )   (7,807 )   21.6 %   (8,234 )   15.3 %

Interest income

   4,039     4,595     -12.1 %   2,030     99.0 %

Interest expense

   (12,214 )   (12,201 )   0.1 %   (8,971 )   36.2 %

Other, net

   (1,316 )   (201 )   555.9 %   (1,293 )   1.7 %

 

  Other non-operating loss of $9.5 million in 2Q06 up 21.6%, QoQ from a loss of $7.8 million in 1Q06, primarily due to a foreign exchange loss of $2.0 million in 2Q06.

 

  Interest expenses of $12.2 million in 2Q06.

Liquidity

Amounts in US$ thousands

 

     2Q06      1Q06

Cash and cash equivalents

   584,643      485,121

Short term investments

   3,487      3,525

Accounts receivable

   257,248      241,020

Inventory

   217,592      196,585

Others

   25,956      16,363

Total current assets

   1,088,926      942,614

Accounts payable

   429,813      286,884

Short-term borrowings

   118,284      211,608

Current portion of long-term debt

   47,160      246,081

Others

   114,636      119,057

Total current liabilities

   709,893      863,630

Cash Ratio

   0.8x      0.6x

Quick Ratio

   1.2x      0.9x

Current Ratio

   1.5x      1.1x

 

8


Capital Structure

Amounts in US$ thousands

 

     2Q06     1Q06  

Cash and cash equivalents

   584,643     485,121  

Short-term investment

   3,487     3,525  

Current portion of promissory note

   29,242     29,493  

Promissory note

   90,537     104,140  

Short-term borrowings

   118,284     211,608  

Current portion of long-term debt

   47,160     246,081  

Long-term debt

   830,743     431,504  

Total debt

   996,187     889,193  

Net cash

   (527,836 )   (534,180 )

Shareholders’ equity

   3,028,259     3,019,086  

Total debt to equity ratio

   32.9 %   29.5 %

Cash Flow Summary

Amounts in US$ thousands

 

     2Q06      1Q06  

Net income

   2,242      (8,743 )

Depreciation & amortization

   220,242      210,595  

Amortization of acquired intangible assets

   11,041      11,024  

Net change in cash

   99,523      (100,676 )

Capex Summary

 

  Capital expenditures for 2Q06 were $317.3 million.

 

  Total planned capital expenditures for 2006 will be approximately $1.1 billion and will be adjusted based on market conditions.

Third Quarter 2006 Guidance

The following statements are forward looking statements which are based on current expectation and which involve risks and uncertainties, some of which are set forth under “Safe Harbor Statements” above.

 

  Sales expected to remain flat or to increase up to 2% over 2Q06.

 

  Gross margins expected to be in the 8% to 12% range.

 

  Operating expense as a percentage of sales expected to be in the mid-teens for 3Q06.

 

  Non-operating interest expense expected to be approximately $15 million to $17 million.

 

  Capital expenditures expected to be approximately $325 million to $360 million.

 

  Depreciation and amortization expected to be approximately $250 million to $260 million.

 

9


Recent Highlights and Announcements

 

  Central China’s First 12-inch Fab Began Construction and Will be Managed by SMIC [2006-06-28]

 

  Elpida’s Advanced 90nm DDR2 SDRAM Successfully Qualified at SMIC Beijing’s 300mm Fab [2006-06-19]

 

  SMIC Shanghai closed a US$600 million Syndicated Term Loan [2006-06-08]

 

  SMIC Shanghai is expecting to enter into a US$600 million Syndicated Term Loan [2006-06-07]

 

  Changes in Directorate [2006-06-01]

 

  Annual General Meeting Held On 30th May, 2006 Poll Results [2006-06-01]

 

  SMIC Adopts ARM Physical IP for Both Low-Power and High-Performance Designs at 90 Nanometer Technology Node [2006-05-31]

 

  SMIC Tianjin Secures Financing for Expansion [2006-05-31]

 

  Chipnuts and SMIC to Jointly Offer C626 Multimedia Chip For Mobile Phones [2006-05-17]

 

  SMIC and Aurora Systems in Volume Production of Digital LCOS Panel Chips [2006-05-08]

 

  SMIC reports 2006 first quarter results [2006-04-28]

 

  SMIC and CADENCE Deliver New Analog Mixed-Signal Reference Flow to Speed Fabless Chip Design [2006-04-13]

Please visit SMIC’s website at http://www.smics.com/website/enVersion/Press_Center/pressRelease.jsp for further details regarding the recent announcements.

CONSOLIDATED BALANCE SHEET

(In US dollars)

 

     As of the end of
     June 30, 2006    March 31, 2006
     (unaudited)    (unaudited)

ASSETS

     

Current assets:

     

Cash and cash equivalents

   584,643,407    485,120,565

Short term investments

   3,486,997    3,525,210

Accounts receivable, net of allowances of $4,360,447 and $3,155,788, respectively

   257,248,338    241,020,392

Inventories

   217,592,385    196,584,559

Prepaid expense and other current assets

   20,171,994    16,363,507

Assets held for sale

   5,782,422    —  
         

Total current assets

   1,088,925,543    942,614,233
         

Land use rights, net

   39,975,613    41,392,218

Plant and equipment, net

   3,378,265,128    3,286,544,385

Acquired intangible assets, net

   183,230,540    191,933,630

Equity investment

   15,760,166    16,762,335

Long-term prepayments

   4,957,320    2,342,957

Deferred tax assets

   18,892,396    —  
         

TOTAL ASSETS

   4,730,006,706    4,481,589,758
         

 

10


LIABILITIES AND STOCKHOLDERS’ EQUITY

    

Current liabilities:

    

Accounts payable

   429,813,127     286,884,436  

Accrued expenses and other current liabilities

   85,373,210     89,469,845  

Short-term borrowings

   118,283,829     211,607,902  

Current portion of promissory note

   29,242,001     29,492,874  

Current portion of long-term debt

   47,160,000     246,081,155  

Income tax payable

   20,548     93,634  
            

Total current liabilities

   709,892,715     863,629,846  
            

Long-term liabilities:

    

Promissory note

   90,537,615     104,140,277  

Long-term debt

   830,742,999     431,504,129  

Long-term payables relating to license agreements

   23,507,429     25,395,010  

Other long-term payable

   10,000,000     —    
            

Total long-term liabilities

   954,788,043     561,039,416  
            

Total liabilities

   1,664,680,758     1,424,669,262  
            

Commitments

    

Minority interest

   37,066,848     37,834,500  

Stockholders’ equity:

    

Ordinary shares, $0.0004 par value, 50,000,000,000 shares authorized, shares issued and outstanding 18,342,734,332 and 18,318,402,283, respectively

   7,337,094     7,327,361  

Warrants

   32,387     32,387  

Additional paid-in capital

   3,275,146,135     3,268,265,625  

Accumulated other comprehensive income

   163,674     122,675  

Accumulated deficit

   (254,420,190 )   (256,662,052 )
            

Total stockholders’ equity

   3,028,259,100     3,019,085,996  
            

TOTAL LIABILITIES AND STOCKHOLDERS’ EQUITY

   4,730,006,706     4,481,589,758  
            

 

11


CONSOLIDATED STATEMENT OF OPERATIONS

(In US dollars)

 

     For the three months ended  
     June 30, 2006     March 31, 2006  
     (unaudited)     (unaudited)  

Sales

   361,445,898     351,137,952  

Cost of sales

   312,229,121     307,767,802  
            

Gross profit

   49,216,777     43,370,150  
            

Operating expenses:

    

Research and development

   24,344,979     20,592,655  

General and administrative

   16,837,020     11,748,899  

Selling and marketing

   3,918,343     5,970,146  

Amortization of acquired intangible assets

   11,041,090     11,023,590  
            

Total operating expenses

   56,141,432     49,335,290  
            

Loss from operations

   (6,924,655 )   (5,965,140 )

Other income (expenses):

    

Interest income

   4,039,328     4,595,384  

Interest expense

   (12,214,076 )   (12,201,407 )

Others, net

   (1,316,005 )   (200,656 )
            

Total other income (expenses), net

   (9,490,753 )   (7,806,679 )
            

Net loss before income taxes

   (16,415,408 )   (13,771,819 )
            

Income tax credit (expenses)

   18,891,787     (13,985 )

Minority interest

   767,652     947,364  

Loss from equity investment

   (1,002,169 )   (1,058,555 )

Cumulative effect of a change in accounting principle

   —       5,153,986  
            

Net income (loss)

   2,241,862     (8,743,009 )
            

Deemed dividends on preference shares

   —       —    
            

Income (loss) attributable to holders of ordinary shares

   2,241,862     (8,743,009 )
            

 

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On the basis of net income (loss) before accounting change per share, basic

   0.0001    (0.0008 )

Cumulative effect of a change in accounting principal per share, basic

   —      0.0003  

Net income (loss) per share, basic

   0.0001    (0.0005 )

On the basis of net income (loss) before accounting change per ADS, basic

   0.0061    (0.0380 )

Cumulative effect of a change in accounting principal per ADS, basic

   —      0.0141  

Net income (loss) per ADS, basic

   0.0061    (0.0239 )

On the basis of net income (loss) before accounting change per share, diluted

   0.0001    (0.0008 )

Cumulative effect of a change in accounting principle per share, diluted

   —      0.0003  

Net income (loss) per share, diluted

   0.0001    (0.0005 )

On the basis of net income (loss) before accounting change per ADS, diluted

   0.0060    (0.0380 )

CONSOLIDATED STATEMENT OF OPERATIONS

(In US dollars)

 

     For the three months ended  
     June 30, 2006    March 31, 2006  
     (unaudited)    (unaudited)  

Cumulative effect of a change in accounting principle per ADS, diluted

   —      0.0141  

Net income (loss) per ADS, diluted

   0.0060    (0.0239 )

Ordinary shares used in calculating basic income per ordinary share (in millions)

   18,303    18,278  
           

Ordinary shares used in calculating diluted income per ordinary share (in millions)

   18,729    18,278  
           

* Amortization of deferred stock compensation related to:

     

Cost of sales

   3,014,597    3,127,678  

Research and development

   1,254,569    1,281,330  

General and administrative

   1,227,469    1,211,830  

Selling and marketing

   509,831    543,929  
           

Total

   6,006,465    6,164,767  
           

(1) 1 ADS equals 50 ordinary shares

 

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CONSOLIDATED STATEMENT OF CASH FLOWS

(In US dollars)

 

     For the three months ended  
     June 30, 2006     March 31, 2006  
     (unaudited)     (unaudited)  

Operating activities:

    

Income (loss) attributable to holders of ordinary shares

   2,241,862     (8,743,009 )

Cumulative effect of a change in accounting principle

   —       (5,153,986 )
            

Net income (loss)

   2,241,862     (13,896,995 )

Adjustments to reconcile net income to net cash provided by (used in) operating activities:

    

Minority interest

   (767,652 )   (947,364 )

Gain (loss) on disposal of plant and equipment

   (516,812 )   1,018  

Depreciation and amortization

   220,242,447     210,595,208  

Amortization of acquired intangible assets

   11,041,089     11,023,590  

Amortization of deferred stock compensation

   6,006,465     6,164,767  

Amortization of loan initiation fee

   59,949     —    

Non-cash interest expense on promissory notes

   1,503,505     1,465,312  

Loss on long-term investment

   1,002,169     1,058,555  

Changes in operating assets and liabilities:

    

Accounts receivable

   (16,227,946 )   313,522  

Inventories

   (21,007,826 )   (5,346,923 )

Prepaid expense and other current assets

   (316,206 )   (853,466 )

Accounts payable

   (13,274,229 )   3,521,334  

Accrued expenses and other current liabilities

   (11,319,565 )   (10,144,265 )

Other long term liabilities

   10,000,000     —    

Income tax payable

   (73,086 )   93,634  

Deferred tax assets

   (18,892,396 )   —    
            

Net cash provided by operating activities

   169,701,768     203,047,927  
            

Investing activities:

    

Purchases of plant and equipment

   (164,934,281 )   (197,518,652 )

Purchases of acquired intangible assets

   (253,074 )   (1,439,000 )

Sale of short-term investments

   30,704     10,250,212  

Proceeds received from living quarter sales

   5,631,255     —    

Proceeds from disposal of fixed assets

   17,479     1,167,914  
            

Net cash used in investing activities

   (159,507,917 )   (187,539,526 )
            

Financing activities:

    

Proceeds from short-term borrowings

   83,161,736     65,125,158  

Proceeds from long-term debt

   592,960,001     59,988,601  

Repayment of long-term debt

   (392,642,286 )   (123,040,282 )

Repayment of promissory notes

   (15,000,000 )   —    

Repayment of short-term borrowings

   (176,485,809 )   (118,998,338 )

Payment of loan initiation fee

   (3,596,938 )   —    

Proceeds from exercise of employee stock options

   883,777     736,003  
            

Net cash provided by financing activities

   89,280,481     (116,188,858 )
            

Effect of foreign exchange rate changes

   48,510     4,135  
            

NET INCREASE (DECREASE) IN CASH AND CASH EQUIVALENTS

   99,522,842     (100,676,322 )

CASH AND CASH EQUIVALENTS, beginning of period

   485,120,565     585,796,887  
            

CASH AND CASH EQUIVALENTS, end of period

   584,643,407     485,120,565  
            

 

14


As at the date of this announcement, the Directors of the Company are Yang Yuan Wang as Chairman and Independent Non-Executive Director of the Company; Richard R. Chang as President, Chief Executive Officer and Executive Director of the Company; Fang Yao as Non-Executive Director of the Company; and Ta-Lin Hsu, Yen-Pong Jou, Tsuyoshi Kawanishi, Henry Shaw, Lip-Bu Tan, Albert Y.C. Yu and Jiang Shang Zhou as Independent Non-Executive Directors of the Company.

 

By order of the Board
Semiconductor Manufacturing International Corporation
Richard R. Chang
Chief Executive Officer

Shanghai, PRC

July 28, 2006

 

* For identification only

“Please also refer to the published version of this announcement in The Standard”

 

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