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Articles published by JEDEC Solid State Technology Association

JEDEC’s SOCAMM2: Low Power Compact LPDDR5X Modules Poised to Power Next-Gen AI Servers
From JEDEC Solid State Technology Association
Via Business Wire
UFS 5.0 Is Coming: JEDEC® Sets the Stage for the Next Leap in Flash Storage
From JEDEC Solid State Technology Association
Via Business Wire
JEDEC Releases New LPDDR6 Standard to Enhance Mobile and AI Memory Performance
From JEDEC Solid State Technology Association
Via Business Wire
JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
From JEDEC Solid State Technology Association
Via Business Wire
JEDEC’s JC-15 Committee Invites Industry Participation for Advancing Thermal Characterization Standards for Semiconductor Packages
From JEDEC Solid State Technology Association
Via Business Wire
JEDEC Unveils Plans for DDR5 MRDIMM and LPDDR6 CAMM Standards to Propel High-Performance Computing and AI
From JEDEC Solid State Technology Association
Via Business Wire
JEDEC Approaches Finalization of HBM4 Standard, Eyes Future Innovations
From JEDEC Solid State Technology Association
Via Business Wire
Intel CEO Pat Gelsinger Receives 2024 Distinguished Executive Leadership Award from JEDEC Board
From JEDEC Solid State Technology Association
Via Business Wire
JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Reverse Bias Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices
From JEDEC Solid State Technology Association
Via Business Wire
JEDEC JC-14.7 Subcommittee Broadens Focus to Include Radio Frequency Technologies
From JEDEC Solid State Technology Association
Via Business Wire
JEDEC Announces Publication of the SPD5118 Hub and Serial Presence Detect Device and the DDR5 SPD Contents Specifications
From JEDEC Solid State Technology Association
Via Business Wire
JEDEC® Updates Universal Flash Storage (UFS) and Supporting Memory Interface Standard
From JEDEC Solid State Technology Association
Via Business Wire
JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard
From JEDEC Solid State Technology Association
Via Business Wire
JEDEC Recognizes Nantero’s Bill Gervasi with Award of Excellence
From JEDEC Solid State Technology Association
Via Business Wire
JEDEC Publishes Update to DDR5 SDRAM Standard Used in High-Performance Computing Applications
From JEDEC Solid State Technology Association
Via Business Wire
JEDEC publishes XFM Embedded and Removable Memory Device Standard to Expand Storage Solutions in Embedded and Automotive Applications
From JEDEC Solid State Technology Association
Via Business Wire
JEDEC Publishes New and Updated Standards for Low Power Memory Devices Used in 5G and AI Applications
From JEDEC Solid State Technology Association
Via Business Wire
SAE International and JEDEC Sign Standards Cooperation Agreement for Microelectronic Use in Aviation, Space and Defense
From JEDEC Solid State Technology Association
Via Business Wire
JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Bias Temperature Instability of Silicon Carbide (SiC) MOS Devices
From JEDEC Solid State Technology Association
Via Business Wire
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